Showing 1 - 20 results of 112 for search 'Tan, Cher Ming', query time: 0.05s Refine Results
  1. 1
    Electromigration in ULSI Interconnections /

    Electromigration in ULSI Interconnections / by Tan, Cher Ming, 1959-

    Published c201
  2. 2
    Effectiveness of reservoir length on electromigration lifetime enhancement for ULSI interconnects with advanced technology nodes

    Effectiveness of reservoir length on electromigration lifetime enhancement for ULSI interconnects with advanced technology nodes by Tan, Cher Ming, Fu, Chunmiao

    Published 2013
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    Conference Paper
  3. 3
    3D simulation-based research on the effect of interconnect structures on circuit reliability

    3D simulation-based research on the effect of interconnect structures on circuit reliability by He, Feifei, Tan, Cher Ming

    Published 2015
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    Journal Article
  4. 4
    Degradation model of a linear-mode LED driver and its application in lifetime prediction

    Degradation model of a linear-mode LED driver and its application in lifetime prediction by Lan, Song, Tan, Cher Ming

    Published 2015
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    Journal Article
  5. 5
    Requirement for accurate interconnect temperature measurement for electromigration test

    Requirement for accurate interconnect temperature measurement for electromigration test by Hou, Yuejin, Tan, Cher Ming

    Published 2010
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    Conference Paper
  6. 6
    Statistical modeling of via redundancy effects on interconnect reliability

    Statistical modeling of via redundancy effects on interconnect reliability by Tan, Cher Ming, Raghavan, Nagarajan

    Published 2010
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    Conference Paper
  7. 7
    The multiple temperature heater platforms for solder Electromigration test conducted at room temperature

    The multiple temperature heater platforms for solder Electromigration test conducted at room temperature by Hou, Yuejin, Tan, Cher Ming

    Published 2010
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    Conference Paper
  8. 8
    Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

    Failure mechanisms of aluminum bondpad peeling during thermosonic bonding by Tan, Cher Ming, Gan, Zhenghao

    Published 2009
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    Journal Article
  9. 9
    Transient electrical thermal analysis of ESD process using 3-D finite element method

    Transient electrical thermal analysis of ESD process using 3-D finite element method by Hou, Yuejin, Tan, Cher Ming

    Published 2010
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    Conference Paper
  10. 10
    3D circuit model for 3D IC reliability study

    3D circuit model for 3D IC reliability study by Tan, Cher Ming, He, Feifei

    Published 2010
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    Conference Paper
  11. 11
    Imperfect predictive maintenance model for multi-state systems with multiple failure modes and element failure dependency

    Imperfect predictive maintenance model for multi-state systems with multiple failure modes and element failure dependency by Tan, Cher Ming, Raghavan, Nagarajan

    Published 2010
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    Conference Paper
  12. 12
    Electromigration reliability of interconnections in RF low noise amplifier circuit

    Electromigration reliability of interconnections in RF low noise amplifier circuit by He, Feifei, Tan, Cher Ming

    Published 2013
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    Journal Article
  13. 13
    Effect of IC layout on the reliability of CMOS amplifiers

    Effect of IC layout on the reliability of CMOS amplifiers by He, Feifei, Tan, Cher Ming

    Published 2013
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    Journal Article
  14. 14
    Comparison of electromigration simulation in test structure and actual circuit

    Comparison of electromigration simulation in test structure and actual circuit by He, Feifei, Tan, Cher Ming

    Published 2013
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    Journal Article
  15. 15
    A framework to practical predictive maintenance modeling for multi-state systems

    A framework to practical predictive maintenance modeling for multi-state systems by Tan, Cher Ming, Raghavan, Nagarajan

    Published 2013
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    Journal Article
  16. 16
    Comparison of stress-induced voiding phenomena in copper line–via structures with different dielectric materials

    Comparison of stress-induced voiding phenomena in copper line–via structures with different dielectric materials by Hou, Yuejin, Tan, Cher Ming

    Published 2013
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    Journal Article
  17. 17
    Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter

    Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter by Tan, Cher Ming, Yu, Wen Zhi

    Published 2014
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    Journal Article
  18. 18
    Design and fabrication of insulated gate bipolar transistor (IGBT) using wafer bonding technology

    Design and fabrication of insulated gate bipolar transistor (IGBT) using wafer bonding technology by Tan, Cher Ming., Tse, Man Siu.

    Published 2008
    Other Authors: “…Tan, Cher Ming…”
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    Research Report
  19. 19
    Using power diode models for circuit simulations : a comprehensive review

    Using power diode models for circuit simulations : a comprehensive review by Tan, Cher Ming, Tseng, King Jet

    Published 2010
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    Journal Article
  20. 20
    Application of Wigner–Ville distribution in electromigration noise analysis

    Application of Wigner–Ville distribution in electromigration noise analysis by Tan, Cher Ming, Lim, Shin Yeh

    Published 2009
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    Journal Article

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