Stitch bond strength study in insulated Cu wire bonding by Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.

Characterisation of insulated Cu wire ball bonding by Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.

Development of insulated cu wire stitch bonding by Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Faiz, M.

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In-depth study and characterization of insulated Cu wire ball bonding by Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Muhammad, F.

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Conceptual design and prototype of smart calling system research by Karuppiah, Karmegam, Krishnan, G. Mohana, Tamilmoli, L., Chan, H. B., Sinn, W. K., Lam, K. Y., Tan, L. C., Seetha, P.

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Association of HLA locus variant in Parkinson's disease by Zhao, Y., Gopalai, A.A., Ahmad-Annuar, A., Teng, E.W.L., Prakash, K.M., Tan, L.C.S., Au, W.L., Li, H.H., Lim, Shen Yang, Lim, Soo Kun, Chong, Yip Boon, Tan, Li Ping, Ibrahim, N.M., Tan, E.K.