Homogeneous chip to wafer bonding of InP-Al2O3-Si using UV/O3 activation by Tan, Chuan Seng, Anantha, P.

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UV/O3 assisted InP/Al2O3–Al2O3/Si low temperature die to wafer bonding by Anantha, P., Tan, Chuan Seng

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Modeling, fabrication, and characterization of 3-D capacitor embedded in through-silicon via by Lin, Ye, Tan, Chuan Seng

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Dielectric quality of 3D capacitor embedded in through-silicon via (TSV) by Lin, Ye, Tan, Chuan Seng

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Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias by Lin, Ye, Tan, Chuan Seng

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Leakage current conduction mechanism in 3D capacitor embedded in Through-Silicon Via (TSV) by Lin, Ye, Tan, Chuan Seng

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Three-dimensional modeling of near-field beam profiles from grating couplers using a deep neural network by Lim, Yu Dian, Tan, Chuan Seng

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Convolutional neural network classification of beam profiles from silicon photonics gratings by Lim, Yu Dian, Tan, Chuan Seng

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Modelling and next-value prediction of beam propagation from grating structures using a simplified transformer model by Lim, Yu Dian, Tan, Chuan Seng

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Growth and characterization of germanium epitaxial film on silicon (001) using reduced pressure chemical vapor deposition by Tan, Yew Heng, Tan, Chuan Seng

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Monolithic CMOS-MEMS integration for high-g accelerometers by Narasimhan, Vinayak, Li, Holden, Tan, Chuan Seng

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Lateral GeSn waveguide-based homojunction phototransistor for next-generation 2000nm communication and sensing applications by Kumar, Harshvardhan, Chen, Qimiao, Tan, Chuan Seng

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Theoretical insights into the amplified optical gain of hexagonal germanium by strain engineering by Mayengbam, Rishikanta, Tan, Chuan Seng, Fan, Weijun

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Wafer level 3-D ICs process technology / by Gutmann, Ronald J., Reif, Rafael, Tan, Chuan Seng

Multi-layer three-dimensional silicon electronics enabled by wafer bonding by Tan, Chuan Seng, Ph. D. Massachusetts Institute of Technology

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Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV) by Lin, Ye, Li, Hong Yu, Tan, Chuan Seng

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High-κ Al2O3 material in low temperature wafer-level bonding for 3D integration application by Tan, Chuan Seng, Fan, J., Tu, L. C.

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Integration of CNTs in 3D-IC interconnects: a non-destructive approach for the precise characterization and elucidation of interfacial properties by Ghosh, K., Verma, Y. K., Tan, Chuan Seng

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The theoretical optical gain of Ge1−xSnx nanowires by Xiong, Wen, Fan, Weijun, Song, Zhigang, Tan, Chuan Seng

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Design of directional-emission GeSn multi-quantum-well light-emitting diodes on Si by Chen, Qimiao, Mao, Weijie, Zhang, Lin, Tan, Chuan Seng

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