Research on Polycrystalline Films for Micro- and Nano-Systems by Thompson, Carl V.

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Processing, Structure, Properties, and Reliability of Metals for Microsystems by Thompson, Carl V.

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Weak temperature dependence of stress relaxation in as-deposited polycrystalline gold films by Thompson, Carl V., Leib, J.

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Regular pattern formation through the retraction and pinch-off of edges during solid-state dewetting of patterned single crystal films by Ye, Jongpil, Thompson, Carl V.

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Growth and Properties of (001)-oriented Pb(Zr₀.₅₂Ti₀.₄₈)O₃/LaNiO₃ Films on Si(001) Substrates with TiN Buffer Layers by Zhu, Tie-Jun, Lu, Li, Thompson, Carl V.

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The Effect of Periodic Silane Burst on the Properties of GaN on Si (111) Substrates by Zang, Keyan, Chua, Soo-Jin, Thompson, Carl V.

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Metallic Cluster Coalescence: Molecular Dynamics Simulations of Boundary Formation by Takahashi, A. R., Thompson, Carl V., Carter, W. Craig

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Atomistic Simulations of Metallic Cluster Coalescence by Takahashi, A. R., Thompson, Carl V., Carter, W. Craig

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Evolution of AlN buffer layers on Silicon and the effect on the property of the expitaxial GaN film by Zang, Keyan, Wang, Lianshan, Chua, Soo-Jin, Thompson, Carl V.

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Structural analysis of metalorganic chemical vapor deposited AlN nucleation layers on Si (111) by Zang, Keyan, Wang, Lianshan, Chua, Soo-Jin, Thompson, Carl V.

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Spatial distribution of structural degradation under high-power stress in AlGaN/GaN high electron mobility transistors by Li, Libing, Joh, Jungwoo, Thompson, Carl V., del Alamo, Jesus A.

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Characterization and Modeling of Stress Evolution During Nickel Silicides Formation by Liew, K.P., Li, Yi, Yeadon, Mark, Bernstein, R., Thompson, Carl V.

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Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees by Gan, C.L., Thompson, Carl V., Pey, Kin Leong, Choi, Wee Kiong

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Evolution of structural defects associated with electrical degradation in AlGaN/GaN high electron mobility transistors by Makaram, Prashanth, Joh, Jungwoo, del Alamo, Jesus A., Palacios, Tomas, Thompson, Carl V.

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Crystallographic analysis of the solid-state dewetting of polycrystalline gold film using automated indexing in a transmission electron microscope by Jang, S. A., Lee, H. J., Oh, Y. J., Thompson, Carl V., Ross, Caroline A.

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Effects of Applied Loads, Effective Contact Area and Surface Roughness on the Dicing Yield of 3D Cu Bonded Interconnects by Leong, Hoi Liong, Gan, C.L., Pey, Kin Leong, Thompson, Carl V., Li, Hongyu

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Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In solders by Thompson, Carl V., Sasangka, W. A., Gan, Chee Lip, Choi, W. K., Wei, J.

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Carbon Nanotube Growth Using Ni Catalyst in Different Layouts by Nguyen, H. Q., Krishnan, R., Choi, K. W., Thompson, Carl V., Lim, F. Y.

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Condensation on Superhydrophobic Surfaces: The Role of Local Energy Barriers and Structure Length Scale by Enright, Ryan, Miljkovic, Nenad, Thompson, Carl V., Wang, Evelyn N., Al-Obeidi, Ahmed F.

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Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects by Chang, Choon Wai, Gan, C.L., Thompson, Carl V., Pey, Kin Leong, Choi, Wee Kiong

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