Obfuscation techniques for Java source code by Nguyen, Dinh Phuc

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Evaluating variational autoencoder methods for out-of-distribution detection in autonomous vehicles by Dinh, Phuc Hung

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Understanding technology flux : analysing patent applications to understand economics activities by Nguyen, Dinh Phuc

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Assessment of methods used for 3-dimensional superimposition of craniofacial skeletal structures: a systematic review by Daniel Dinh-Phuc Mai, Sven Stucki, Nikolaos Gkantidis

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Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating by Yu-Wen Hung, Dinh-Phuc Tran, Chih Chen

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Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures by Shih-Chi Yang, Dinh-Phuc Tran, Chih Chen

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Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling by Chun-Chieh Mo, Dinh-Phuc Tran, Jing-Ye Juang, Chih Chen

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Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu by Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen

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Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste by Yu-Hao Kuo, Dinh-Phuc Tran, Jia-Juen Ong, K.N. Tu, Chih Chen

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Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films by Po-Fan Lin, Dinh-Phuc Tran, Hung-Che Liu, Yi-Yi Li, Chih Chen

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Failures of Cu-Cu Joints under Temperature Cycling Tests by Po-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, Nien-Ti Tsou, Chih Chen

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Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling by Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, Dinh-Phuc Tran, Chih Chen

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Effect from Combinations of Yucca schidigera extract with Bacillus Strains on the Growth of White Leg Shrimp (Penaeus vannamei), Density of Vibrio sp., and on the Ammonia and Nitri... by To Dinh Phuc, Nguyen Thuy Huong, Pham Thi Thu Dan, Bui Thi Hong Linh, Truong Van Mui

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Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding by Hsiang-Hou Tseng, Man-Chi Lan, Wei-You Hsu, Jia-Juen Ong, Dinh-Phuc Tran, Chih Chen

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Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints by Po-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, Kai-Cheng Shie, Nien-Ti Tsou, Chih Chen

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Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing by Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen

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Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints by Jia-Juen Ong, Dinh-Phuc Tran, Man-Chi Lan, Kai-Cheng Shie, Po-Ning Hsu, Nien‑Ti Tsou, Chih Chen

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To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints by Yan-Rong Huang, Dinh-Phuc Tran, Po-Ning Hsu, Shih-Chi Yang, A.M. Gusak, K.N. Tu, Chih Chen

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High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation by Pin-Syuan He, Dinh-Phuc Tran, Ting-Yu Kuo, Wei-You Hsu, Huai-En Lin, Kai-Cheng Shie, Chih Chen

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Low operating voltage resistive random access memory based on graphene oxide–polyvinyl alcohol nanocomposite thin films by Huu Thoai Ngo, Minh Trang Thi Nguyen, Dinh Phuc Do, Kim My Tran, Kieu Hanh Thi Ta, Bach Thang Phan, Kim Ngoc Pham

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