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  1. 1
    Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder

    Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder by Roman Kolenak, Tomas Melus, Jaromir Drapala, Peter Gogola, Matej Pasak

    Published 2023-04-01
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    Article
  2. 2
    Ultrasonic soldering of Al<sub>2</sub>O<sub>3</sub> ceramics and Ni-SiC composite by use of Bi-based active solder

    Ultrasonic soldering of Al<sub>2</sub>O<sub>3</sub> ceramics and Ni-SiC composite by use of Bi-based active solder by Tomáš Meluš, Roman Koleňák, Jaromír Drápala, Paulína Babincová, Matej Pašák

    Published 2023-02-01
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    Article

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