Solder joint technology : materials, properties, and reliability / by 391944 Tu, K. N. (King-ning), 1937-

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Electronic thin film reliability / by 391944 Tu, K. N. (King-ning), 1937-

Analytical modeling of reservoir effect on electromigration in Cu interconnects by Zaporozhets, T., Tu, K. N., Gusak, A. M., Shao, W., Gan, Zhenghao, Chen, Zhong, Mhaisalkar, Subodh Gautam

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Thin films and interfaces/ by Ho, P. S., Tu, K. N., Proceedings of the Materials Research Society Annual Meeting on thin films and interfaces (1981 : Boston, Massachusetts)

Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects by Shao, W., Chen, Z., Tu, K. N., Gusak, A. M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Li, Hong Yu

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Approaching the ideal elastic strain limit in silicon nanowires by Zhang, H., Tersoff, J., Xu, S., Chen, H., Zhang, Q., Zhang, K., Yang, Y., Lee, C.-S., Tu, K.-N., Lu, Y., Li, James

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Pulse electroplating of copper film : a study of process and microstructure by Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, Chee C., Mhaisalkar, Subodh Gautam, Li, X. M., Tung, Chih Hang, Cheng, C. K.

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