Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer under Various Substrate Bias by Devi Indrawati Syafei, Meng-Ting Chiang, Tung-Han Chuang

Get full text

Effects of substrate bias on the sputtering of high density (111)-nanotwinned Cu films on SiC chips by Zi-Hong Yang, Po-Ching Wu, Tung-Han Chuang

Get full text

Effect of Post-Weld Heat Treatment on the Solid-State Diffusion Bonding of 6061 Aluminum Alloy by Chun-Hao Chen, Yu-Kai Sun, Yu-Chang Lai, Shih-Ying Chang, Tung-Han Chuang

Get full text

Effects of Adding Active Elements to Aluminum-Based Filler Alloys on the Bonding of 6061 Aluminum Alloy and Alumina by Yu-Kai Sun, Shih-Ying Chang, Lung-Chuan Tsao, Tung-Han Chuang, Guo-Zhan Zhang, Chih-Yi Yeh

Get full text

Improvement of the Mechanical Properties of the Diffusion-Bonded 2024 Aluminum Alloy through Post-Weld Heat Treatments by Meng-Ting Chiang, Kuan-Yu Chiu, Po-Ching Wu, Shih-Ying Chang, Yu-Kai Sun, Tung-Han Chuang

Get full text

Highly Stable and Enhanced Performance of p–i–n Perovskite Solar Cells via Cuprous Oxide Hole-Transport Layers by Tung-Han Chuang, Yin-Hung Chen, Shikha Sakalley, Wei-Chun Cheng, Choon Kit Chan, Chih-Ping Chen, Sheng-Chi Chen

Get full text