Effect of Wafer Bow and Etch Patterns in Direct Wafer Bonding by Spearing, S. Mark, Turner, K.T.

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Structure-property relationships from universal signatures of plasticity in disordered solids by Cubuk, E. D., Ivancic, R. J. S., Schoenholz, S. S., Strickland, D. J., Basu, A., Davidson, Z. S., Fontaine, J., Hor, J. L., Huang, Y.-R., Jiang, Y., Keim, N. C., Koshigan, K. D., Lefever, J. A., Liu, T., Ma, X.-G., Magagnosc, D. J., Morrow, E., Ortiz, C. P., Rieser, J. M., Shavit, A., Still, T., Xu, Y., Zhang, Y., Nordstrom, K. N., Arratia, P. E., Carpick, R. W., Durian, D. J., Fakhraai, Z., Jerolmack, D. J., Lee, Daeyeon, Li, Ju, Riggleman, R., Turner, K. T., Yodh, A. G., Gianola, D. S., Liu, Andrea J.

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