Dispersion of InSb Nanoinclusions in Cu3SbS4 for Improved Stability and Thermoelectric Efficiency by Vaskuri C. S. Theja, Vaithinathan Karthikeyan, Dani S. Assi, Hongli Huang, Chan-Hung Shek, Vellaisamy A. L. Roy

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Three dimensional architected thermoelectric devices with high toughness and power conversion efficiency by Vaithinathan Karthikeyan, James Utama Surjadi, Xiaocui Li, Rong Fan, Vaskuri C. S. Theja, Wen Jung Li, Yang Lu, Vellaisamy A. L. Roy

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Quantum Topological Neuristors for Advanced Neuromorphic Intelligent Systems by Dani S. Assi, Hongli Huang, Vaithinathan Karthikeyan, Vaskuri C. S. Theja, Maria Merlyne deSouza, Ning Xi, Wen Jung Li, Vellaisamy A. L. Roy

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3D Architectural MXene‐based Composite Films for Stealth Terahertz Electromagnetic Interference Shielding Performance by Vaskuri C. S. Theja, Dani S. Assi, Hongli Huang, Raghad Saud Alsulami, Bao Jie Chen, Chi Hou Chan, Chan‐Hung Shek, Vaithinathan Karthikeyan, Vellaisamy A. L. Roy

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