Effect of Surface Roughness on the Electrical Performances of CPW Transmission Lines Used in Future Ultra-High Frequency Applications by Zhiqiang Chen, Wenchao Tian

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Molecular Dynamics Analysis of Graphene Nanoelectromechanical Resonators Based on Vacancy Defects by Wenhua Li, Wenchao Tian

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Research of Vertical via Based on Silicon, Ceramic and Glass by Wenchao Tian, Sixian Wu, Wenhua Li

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Visualization and Heat Transfer Performance of Mini-Grooved Flat Heat Pipe Filled with Different Working Fluids by Fei Xin, Qiang Lyu, Wenchao Tian

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The Deformation of a Liquid Metal Droplet Under Continuous Acceleration in a Variable Cross-Section Groove by Hanyang Xu, Haojie Dang, Wenchao Tian, Zhao Li

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Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging by Wenchao Tian, Zhao Li, Yongkun Wang, Guoguang Zhang

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The Study of the Reliability of Complex Components during the Electromigration Process by Hao Cui, Wenchao Tian, Yiming Zhang, Zhiqiang Chen

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Characteristics of a novel thermal-induced epoxy shape memory polymer for smart device applications by Hao Cui, Wenchao Tian, Yu Kang, Yongkun Wang

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Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration by Wenchao Tian, Feiyang Li, Mang He, Haoyue Ji, Si Chen

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Three-Dimensional Integrated Fan-Out Wafer-Level Package Micro-Bump Electromigration Study by Wenchao Tian, Ran Gao, Lin Gu, Haoyue Ji, Liming Zhou

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Research of Wafer Level Bonding Process Based on Cu–Sn Eutectic by Daowei Wu, Wenchao Tian, Chuqiao Wang, Ruixia Huo, Yongkun Wang

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Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package by Wenchao Tian, Wenbin Li, Shuaiqi Zhang, Liming Zhou, Heng Wang

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Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling by Wenchao Tian, Haojie Dang, Dexin Li, Yunhao Cong, Yuanming Chen

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Delamination of Plasticized Devices in Dynamic Service Environments by Wenchao Tian, Xuyang Chen, Guoguang Zhang, Yuanming Chen, Jijun Luo

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Hydrogen Storage Performance of γ-Graphdiyne Doped Li Based on First Principles for Micro/Nano by Wenchao Tian, Zhao Li, Chunmin Cheng, Wenhua Li, Zhiqiang Chen, Fei Xin

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A Method for Broadband Polyimide Permittivity Measurement of Silicon Interposer Applied for High Speed Digital Microsystem by Zhuoyue Zheng, Yongkun Wang, Lei Han, Daowei Wu, Defeng Mo, Wenchao Tian

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The Reliability of the Complex Components under Temperature Cycling, Random Vibration, and Combined Loading for Airborne Applications by Hao Cui, Wenchao Tian, Hanyang Xu, Heng Wang, Jiabo Huang, Chunxi Peng, Zhiqiang Chen

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Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review by Yongkun Wang, Haozheng Liu, Linghua Huo, Haobin Li, Wenchao Tian, Haoyue Ji, Si Chen

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Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method by Haoyue Ji, Wenchao Tian, Hongwen Qian, Xiaodong Sun, Yongkun Wang, Lin Gu, Lihua Zheng

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Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions by Wenchao Tian, Bin Li, Zhao Li, Hao Cui, Jing Shi, Yongkun Wang, Jingrong Zhao

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