Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach by Shih-Hung Wang, Wensyang Hsu, Yan-Yu Liou, Pei-Chen Huang, Chang-Chun Lee

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Bead Number Effect in a Magnetic-Beads-Based Digital Microfluidic Immunoassay by Wensyang Hsu, Yu-Teng Shih, Meng-Shiue Lee, Hong-Yuan Huang, Wan-Ning Wu

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Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach by Shih-Hung Wang, Wensyang Hsu, Yan-Yu Liou, Pei-Chen Huang, Chang-Chun Lee

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Detection of Interleukin-1 β (IL-1β) in Single Human Blastocyst-Conditioned Medium Using Ultrasensitive Bead-Based Digital Microfluidic Chip and Its Relationship with Embryonic Imp... by Tian-Chi Tsai, Yi-Wen Wang, Meng-Shiue Lee, Wan-Ning Wu, Wensyang Hsu, Da-Jeng Yao, Hong-Yuan Huang

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Characterizing deep brain biosignals: The advances and applications of implantable MEMS-based devices by Hsin-Yu Wu, Kao-Jung Chang, Ximiao Wen, Aliaksandr A. Yarmishyn, He-Jhen Dai, Kai-Hsiang Chan, Hsiao Yu-Jer, Ming-Teh Chen, Yueh Chien, Hsin-I Ma, Wensyang Hsu, Meng-Shiue Lee, Shih-Hwa Chiou

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Corrigendum to ‘Characterizing deep brain biosignals: The advances and applications of implantable MEMS-based devices’ [Materials Today Advances 16 (2022) 100322] by Hsin-Yu Wu, Kao-Jung Chang, Ximiao Wen, Aliaksandr A. Yarmishyn, He-Jhen Dai, Kai-Hsiang Chan, Yu-Jer Hsiao, Ming-Teh Chen, Yueh Chien, Hsin-I Ma, Wensyang Hsu, Meng-Shiue Lee, Shih-Hwa Chiou

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