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Xingchao Mao
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Xingchao Mao
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Xingchao Mao
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1
Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications
by
Fengyi Wang
,
Xinjie Wang
,
Xingchao Mao
,
Fangcheng Duan
,
Chunjin Hang
,
Hongtao Chen
,
Mingyu Li
Published 2022-11-01
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Article
2
Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps
by
Xingchao Mao
,
Yuxuan An
,
Yang Chen
,
Gong Zheng
,
Rui Hou
,
Xinyu Zhang
,
Yuzheng Guo
,
Sheng Liu
,
King-Ning Tu
,
Yingxia Liu
Published 2024-05-01
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Article
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