Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding by Wan-Geun Lee, Kwang-Seong Choi, Yong-Sung Eom, Jong-Hyun Lee

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Collective laser‐assisted bonding process for 3D TSV integration with NCP by Wagno Alves Braganca, Yong‐Sung Eom, Keon‐Soo Jang, Seok Hwan Moon, Hyun‐Cheol Bae, Kwang‐Seong Choi

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Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining by Gwang-Mun Choi, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, Yong-Sung Eom

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Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding by Xuan-Luc Le, Xuan-Bach Le, Yuhwan Hwangbo, Jiho Joo, Gwang-Mun Choi, Yong-Sung Eom, Kwang-Seong Choi, Sung-Hoon Choa

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Self-Powered Autonomous Wireless Sensor Node by Using Silicon-Based 3D Thermoelectric Energy Generator for Environmental Monitoring Application by Jong-Pil Im, Jeong Hun Kim, Jae Woo Lee, Ji Yong Woo, Sol Yee Im, Yeriaron Kim, Yong-Sung Eom, Won Chul Choi, Jun Soo Kim, Seung Eon Moon

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