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Advanced Electronic Packaging Technology: From Hard to Soft by Yue Gu, Yongjun Huo
Published 2023-03-01
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Comparison between bulk and particle solder alloy on the performance of low-melting solder joints by Mingkun Yang, Xiuchen Zhao, Yongjun Huo, King-Ning Tu, Yingxia Liu
Published 2023-05-01
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The quality of migrant patients’ primary healthcare experiences and patient-centered medical home achievement by community health centers: results from the China greater bay area s... by Yongjun Huo, Xun Kang, Chenyang Zhong, Leiyu Shi, Ruqing Liu, Ruwei Hu
Published 2023-06-01
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