Solid-State Qubits: 3D Integration and Packaging by Rosenberg, D, Weber, SJ, Conway, D, Yost, DRW, Mallek, J, Calusine, G, Das, R, Kim, D, Schwartz, ME, Woods, W, Yoder, JL, Oliver, WD

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Characterization of superconducting through-silicon vias as capacitive elements in quantum circuits by Hazard, TM, Woods, W, Rosenberg, D, Das, R, Hirjibehedin, CF, Kim, DK, Knecht, JM, Mallek, J, Melville, A, Niedzielski, BM, Serniak, K, Sliwa, KM, Yost, DRW, Yoder, JL, Oliver, WD, Schwartz, ME

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Solid-state qubits integrated with superconducting through-silicon vias by Yost, DRW, Schwartz, ME, Mallek, J, Rosenberg, D, Stull, C, Yoder, JL, Calusine, G, Cook, M, Das, R, Day, AL, Golden, EB, Kim, DK, Melville, A, Niedzielski, BM, Woods, W, Kerman, AJ, Oliver, WD

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