Stress Analysis of Tungsten Deposition in a 3D Trench Mold With Regard to Initial Nuclei Shape by Jong-Sung Lee, Suncheul Kim, Donghoon Han, Myoung-Gyu Lee, Young-Chang Joo

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Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects by Seongi Lee, Jae-Myeong Shin, Jun Hyeok Hyun, In-Suk Choi, Young-Chang Joo, Byoung-Joon Kim, So-Yeon Lee

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Robust Co alloy design for Co interconnects using a self-forming barrier layer by Cheol Kim, Geosan Kang, Youngran Jung, Ji-Yong Kim, Gi-Baek Lee, Deokgi Hong, Yoongu Lee, Soon-Gyu Hwang, In-Ho Jung, Young-Chang Joo

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Quasi-graphitic carbon shell-induced Cu confinement promotes electrocatalytic CO2 reduction toward C2+ products by Ji-Yong Kim, Deokgi Hong, Jae-Chan Lee, Hyoung Gyun Kim, Sungwoo Lee, Sangyong Shin, Beomil Kim, Hyunjoo Lee, Miyoung Kim, Jihun Oh, Gun-Do Lee, Dae-Hyun Nam, Young-Chang Joo

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Biodegradable Metallic Glass for Stretchable Transient Electronics by Jae‐Young Bae, Eun‐Ji Gwak, Gyeong‐Seok Hwang, Hae Won Hwang, Dong‐Ju Lee, Jong‐Sung Lee, Young‐Chang Joo, Jeong‐Yun Sun, Sang Ho Jun, Myoung‐Ryul Ok, Ju‐Young Kim, Seung‐Kyun Kang

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