Showing 1 - 2 results of 2 for search 'Yuan-Chiu Huang', query time: 0.02s Refine Results
  1. 1
    Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications

    Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications by Yuan-Chiu Huang, Han-Wen Hu, Yun-Hsi Liu, Hui-Ching Hsieh, Kuan-Neng Chen

    Published 2024-01-01
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    Article
  2. 2
    Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application

    Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application by Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, Tzu-Heng Hung, Kuan-Neng Chen

    Published 2023-09-01
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    Article

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