Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint by Zetty Akhtar, Abd Malek

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Investigation on weld quality using different filler metals by Zetty Akhtar, Abd Malek

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Investigation on Aluminium-Stainless Steel Dissimilar Weld Quality Using Different Filler Metals by L. H., Shah, Zetty Akhtar, Abd Malek, M., Ishak

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A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability by Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris

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Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow by Siti Rabiatull Aisha, Idris, Siti, Zuleikha, Zetty Akhtar, Abd Malek

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A Review on Effect of Nickel Doping on Solder Joint Reliability by Siti Rabiatull Aisha, Idris, Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar

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Effect of Immersion Coating Deposition Time on Solder Joint Properties by Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak

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Intermetallic Growth and Shear Strength of SAC305/EN-Boron by Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak

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Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish by Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak

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Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish by Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak

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An experimental investigation on thermal conductivity and viscosity of graphene doped CNTs /TiO2 nanofluid by Zetty Akhtar, Abd Malek, M. M., Rahman, K., Kadirgama, Maleque, M. A.

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Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy by Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak

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Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating by Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak

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Microstructure Evolution at the Solder Joint During Isothermal Aging by Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak

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A comprehensive review on thermal conductivity and viscosity of nanofluids by Urmi, Wajiha Tasnim, Rahman, Md Mustafizur, Kadirgama, Kumaran, Zetty Akhtar, Abd Malek, Wahaizad, Safiei

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Evaluation Of Cutting Force in End Milling Process of Aluminum Alloy 6061-T6 Using Tungsten Carbide Inserts with MQL Method Utilizing Hybrid Nanofluid by Wahaizad, Safiei, M. M., Rahman, A. R., Yusoff, Wajiha Tasnim, Urmi, Zetty Akhtar, Abd Malek

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Thermal Conductivity and Dynamic Viscosity of Nanofluids: A Review by Wahaizad, Safiei, M. M., Rahman, Kulkarni, R. R., Md Noor, Ariffin, Zetty Akhtar, Abd Malek

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