Process induced reliability of through silicon via by Zhang, Jiye

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Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief by Ghosh, Kaushik, Zhang, Jiye, Zhang, Lin, Dong, Yuanwei, Li, Hong Yu, Tan, Cher Ming, Xia, Guangrui, Tan, Chuan Seng

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Reliability analysis of the Ahringer <it>Caenorhabditis elegans </it>RNAi feeding library: a guide for genome-wide screens by Lu Yiming, Hang Xingyi, Wang Xiaolei, Zhang Jiye, Shi Jinping, Li Yuan, Ren Changhong, Qu Wubin, Zhao Dongsheng, Zhang Chenggang

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Engineering built-in electric field microenvironment of CQDs/g-C3N4 heterojunction for efficient photocatalytic CO2 reduction by Xu, Yun, Hou, Weidong, Huang, Kai, Guo, Huazhang, Wang, Zeming, Lian, Cheng, Zhang, Jiye, Wu, Deli, Lei, Zhendong, Liu, Zheng, Wang, Liang

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Semiconductor glass with superior flexibility and high room temperature thermoelectric performance by He, Shiyang, Li, Yongbo, Liu, Lu, Jiang, Ying, Feng, Jingjing, Zhu, Wei, Zhang, Jiye, Dong, Zirui, Deng, Yuan, Luo, Jun, Zhang, Wenqing, Chen, Gang

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