The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2006

Bibliografski detalji
Glavni autor:	Moey, Chin Boon
Format:
Jezik:	may
Izdano:	Skudai : Universiti Teknologi Malaysia, 2006
Teme:	Solder and soldering Intermetallic compounds

Slični predmeti

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish /
od: 200265 Moey, Chin Boon
Izdano: (2005)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
od: 200265 Moey, Chin Boon
Izdano: (2005)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
od: 458317 Liew, Chung Wah, i dr.
Izdano: (2007)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
od: 380319 Ching, Sze Pei
Izdano: (2006)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /
od: 458317 Liew, Chung Wah
Izdano: (2007)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold /
od: Ng, Mei Wah, 1986-, i dr.
Izdano: (2010)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] /
od: Ng, Mei Wah, 1986-
Izdano: (2010)

Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
od: 288113 Siti Rabiatull Aisha Idris, i dr.
Izdano: (2006)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
od: Chua, Chai Ying, 1985-, i dr.
Izdano: (2009)

Interfacial reaction during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel /immersion gold surface finishes /
od: 183648 Ali Ourdjini, i dr.
Izdano: (2007)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
od: 170422 Chua, Chai Ying, i dr.
Izdano: (2009)

Intermetallic formation during soldering on EPIG and Cu surface finishes /
od: 285723 Yusreena Yusuf
Izdano: (2006)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish /
od: Chin, Ee Mei, 1986-, i dr.
Izdano: (2010)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish /
od: 397935 Koh, Joyce Swee Fong
Izdano: (2006)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]
od: Koh, Joyce Swee Fong
Izdano: (2006)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
od: Chin, Ee Mei, 1986-
Izdano: (2010)

Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
od: 285723 Yusreena Yusuf
Izdano: (2006)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish/
od: 244946 Ang, Pei Ling, i dr.
Izdano: (2008)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] /
od: 397935 Koh, Joyce Swee Fong
Izdano: (2006)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish /
od: Tan, Luyeen, 1986-, i dr.
Izdano: (2010)

Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG /
od: 214468 Jalilah Che Mohamed
Izdano: (2006)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
od: Koid, Chun Ping, 1987-, i dr.
Izdano: (2011)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish /
od: 399565 Tai, Siew Fong
Izdano: (2003)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish [electronic resource] /
od: 244946 Ang, Pei Ling, i dr.
Izdano: (2008)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] /
od: Tan, Luyeen, 1986-
Izdano: (2010)

Effect of flux type on intermetallics formation in solder joint /
od: 296018 Cheong, Jeng Seng
Izdano: (2005)

Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] /
od: 214468 Jalilah Che Mohamed
Izdano: (2006)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint /
od: 351526 Tan, Kok Hoong
Izdano: (2006)

Intermetallic compound in lead free solder on electroless nickel/immersion gold surface finish /
od: 458141 Mah, Chia Wen
Izdano: (2003)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
od: Koid, Chun Ping, 1987-
Izdano: (2011)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish /
od: Noor Afzan Muhamad, 1985-, i dr.
Izdano: (2008)

Effect of flux type on intermetallics formation in solder joint [compact disc] /
od: 296018 Cheong, Jeng Seng
Izdano: (2005)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint [compact disc] /
od: 351526 Tan, Kok Hoong
Izdano: (2006)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish [electronic resource] /
od: Noor Afzan Muhamad, 1985-
Izdano: (2008)

Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish /
od: Saliza Azlina Osman, 1982-, i dr.
Izdano: (2008)

Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM /
od: 340491 Phang, Chin Ewe
Izdano: (2003)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish /
od: Ch'ng, Emily Huey Ling, 1984-, i dr.
Izdano: (2007)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /
od: 458460 Wong, Lee Kian
Izdano: (2003)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) [macrofilm] /
od: 458460 Wong, Lee Kian
Izdano: (2003)

Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes /
od: Nurfazlin Abu Hassan, 1984-, i dr.
Izdano: (2009)