Effect of flux type on intermetallics formation in solder joint [microform] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Authors:	Cheong, Jeng Seng, Fakulti Kejuruteraan Mekanikal
Format:
Published:	2005
Subjects:	Solder and soldering

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