Effect of flux type on intermetallics formation in solder joint [microform] /

Effect of flux type on intermetallics formation in solder joint [microform] /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2005

Bibliographic Details
Main Authors:	Cheong, Jeng Seng, Fakulti Kejuruteraan Mekanikal
Format:
Published:	2005
Subjects:	Solder and soldering

Similar Items

Effect of flux type on intermetallics formation in solder joint /
by: 296018 Cheong, Jeng Seng
Published: (2005)

Effect of flux type on intermetallics formation in solder joint [compact disc] /
by: 296018 Cheong, Jeng Seng
Published: (2005)

Intermetallic compounds (IMC) formation during soldering /
by: Zureena Abu Samah, 1985-, et al.
Published: (2008)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]
by: Koh, Joyce Swee Fong
Published: (2006)

Mechanics of solder joints and solder / intermetallic interface under temperature and mechanical loading /
by: 401100 Fethma M. Nor, et al.
Published: (2009)

Mechanics of solder joints and solder / intermetallic interface under temperature and mechanical loading [electronic resource] /
by: 401100 Fethma M. Nor, et al.
Published: (2009)

Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish /
by: Azizah Wahi, 1984-, et al.
Published: (2009)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
by: Koid, Chun Ping, 1987-, et al.
Published: (2011)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish /
by: Ch'ng, Emily Huey Ling, 1984-, et al.
Published: (2007)

Intermetallic compounds (IMC) formation during soldering [electronic resource] /
by: Zureena Abu Samah, 1985-
Published: (2008)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
by: Chua, Chai Ying, 1985-, et al.
Published: (2009)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish/
by: 244946 Ang, Pei Ling, et al.
Published: (2008)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
by: 458317 Liew, Chung Wah, et al.
Published: (2007)

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints
by: Karel Dušek, et al.
Published: (2021-12-01)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
by: 170422 Chua, Chai Ying, et al.
Published: (2009)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish [electronic resource] /
by: 244946 Ang, Pei Ling, et al.
Published: (2008)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint /
by: 351526 Tan, Kok Hoong
Published: (2006)

Methodology for hybrid experimental-numerical determination of solder/intermetallic interface shear strength /
by: Low, Kok Wai, 1984-, et al.
Published: (2007)

Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
by: 288113 Siti Rabiatull Aisha Idris, et al.
Published: (2006)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish /
by: 397935 Koh, Joyce Swee Fong
Published: (2006)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint [compact disc] /
by: 351526 Tan, Kok Hoong
Published: (2006)

Intermetallic formation during soldering on EPIG and Cu surface finishes /
by: 285723 Yusreena Yusuf
Published: (2006)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish /
by: 200265 Moey, Chin Boon
Published: (2005)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] /
by: 397935 Koh, Joyce Swee Fong
Published: (2006)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /
by: Moey, Chin Boon
Published: (2006)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
by: Koid, Chun Ping, 1987-
Published: (2011)

Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish [electronic resource] /
by: Azizah Wahi, 1984-, et al.
Published: (2009)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc]
by: Ch'ng, Emily Huey Ling, 1984-
Published: (2007)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
by: 200265 Moey, Chin Boon
Published: (2005)

Methods of test for resin flux cored solder
by: 982 SIRIM

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish /
by: Chin, Ee Mei, 1986-, et al.
Published: (2010)

Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
by: 285723 Yusreena Yusuf
Published: (2006)

Methodology for hyvbrid experimental numerical determination of solder/intermetallic interface shear strength [electronic resource] /
by: Low, Kok Wai, 1984-
Published: (2007)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
by: 380319 Ching, Sze Pei
Published: (2006)

Interfacial reactions during soldering between lead-free solders and immersion silver surface finish /
by: Tyah, Jun Hao, 1985-, et al.
Published: (2009)

Interfacial reactions during soldering of lead-free solders on copper and nickel substrates /
by: Siti Rabiatull Aisha Idris, 1983-, et al.
Published: (2012)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish /
by: Tan, Luyeen, 1986-, et al.
Published: (2010)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold /
by: Ng, Mei Wah, 1986-, et al.
Published: (2010)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /
by: 458317 Liew, Chung Wah
Published: (2007)

Interfacial reaction during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel /immersion gold surface finishes /
by: 183648 Ali Ourdjini, et al.
Published: (2007)