Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006
| Prif Awdur: | |
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| Fformat: | |
| Iaith: | may |
| Cyhoeddwyd: |
Skudai : Universiti Teknologi Malaysia,
2006
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| Pynciau: |
| _version_ | 1826357144519180288 |
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| author | Koh, Joyce Swee Fong |
| author_facet | Koh, Joyce Swee Fong |
| author_sort | Koh, Joyce Swee Fong |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006 |
| first_indexed | 2024-03-04T13:02:10Z |
| format | |
| id | KOHA-OAI-TEST:11291 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | may |
| last_indexed | 2024-03-04T13:02:10Z |
| publishDate | 2006 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:112912020-12-19T16:55:24ZEffect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform] Koh, Joyce Swee Fong Skudai : Universiti Teknologi Malaysia,2006mayProject Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 20060PSZJBLSolder and solderingIntermetallic compounds |
| spellingShingle | Solder and soldering Intermetallic compounds Koh, Joyce Swee Fong Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform] |
| title | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform] |
| title_full | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform] |
| title_fullStr | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform] |
| title_full_unstemmed | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform] |
| title_short | Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform] |
| title_sort | effect of solder bump size on intermetallic compound formation during soldering on ni au surface finish microform |
| topic | Solder and soldering Intermetallic compounds |
| work_keys_str_mv | AT kohjoycesweefong effectofsolderbumpsizeonintermetalliccompoundformationduringsolderingonniausurfacefinishmicroform |