Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]

ग्रंथसूची विवरण
मुख्य लेखक:	Koh, Joyce Swee Fong
स्वरूप:
भाषा:	may
प्रकाशित:	Skudai : Universiti Teknologi Malaysia, 2006
विषय:	Solder and soldering Intermetallic compounds

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish /
द्वारा: 397935 Koh, Joyce Swee Fong
प्रकाशित: (2006)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] /
द्वारा: 397935 Koh, Joyce Swee Fong
प्रकाशित: (2006)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
द्वारा: 380319 Ching, Sze Pei
प्रकाशित: (2006)

Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
द्वारा: 288113 Siti Rabiatull Aisha Idris, और अन्य
प्रकाशित: (2006)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish/
द्वारा: 244946 Ang, Pei Ling, और अन्य
प्रकाशित: (2008)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish [electronic resource] /
द्वारा: 244946 Ang, Pei Ling, और अन्य
प्रकाशित: (2008)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
द्वारा: Chua, Chai Ying, 1985-, और अन्य
प्रकाशित: (2009)

Intermetallic formation during soldering on EPIG and Cu surface finishes /
द्वारा: 285723 Yusreena Yusuf
प्रकाशित: (2006)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
द्वारा: 170422 Chua, Chai Ying, और अन्य
प्रकाशित: (2009)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /
द्वारा: 458460 Wong, Lee Kian
प्रकाशित: (2003)

Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /
द्वारा: 396114 Nordiana Najib
प्रकाशित: (2004)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
द्वारा: 458317 Liew, Chung Wah, और अन्य
प्रकाशित: (2007)

Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
द्वारा: 285723 Yusreena Yusuf
प्रकाशित: (2006)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) [macrofilm] /
द्वारा: 458460 Wong, Lee Kian
प्रकाशित: (2003)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish /
द्वारा: Chin, Ee Mei, 1986-, और अन्य
प्रकाशित: (2010)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /
द्वारा: 458317 Liew, Chung Wah
प्रकाशित: (2007)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
द्वारा: Chin, Ee Mei, 1986-
प्रकाशित: (2010)

Effect of flux type on intermetallics formation in solder joint /
द्वारा: 296018 Cheong, Jeng Seng
प्रकाशित: (2005)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint /
द्वारा: 351526 Tan, Kok Hoong
प्रकाशित: (2006)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish /
द्वारा: 200265 Moey, Chin Boon
प्रकाशित: (2005)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /
द्वारा: Moey, Chin Boon
प्रकाशित: (2006)

Effect of flux type on intermetallics formation in solder joint [compact disc] /
द्वारा: 296018 Cheong, Jeng Seng
प्रकाशित: (2005)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
द्वारा: 200265 Moey, Chin Boon
प्रकाशित: (2005)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint [compact disc] /
द्वारा: 351526 Tan, Kok Hoong
प्रकाशित: (2006)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish /
द्वारा: Tan, Luyeen, 1986-, और अन्य
प्रकाशित: (2010)

Intermetallics in lead-free solder on direct immersion gold under bump metallugy /
द्वारा: Chew, Li Ling, 1981-
प्रकाशित: (2003)

Interfacial reactions between lead-free solders and ENIG/ENEPIG surface finishes /
द्वारा: 282552 Saszlena Rasmi
प्रकाशित: (2006)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] /
द्वारा: Tan, Luyeen, 1986-
प्रकाशित: (2010)

Interfacial reactions between lead-free solders and engineering surface finishes [electronic resource ] /
द्वारा: 282552 Saszlena Rasmi
प्रकाशित: (2006)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish /
द्वारा: Noor Afzan Muhamad, 1985-, और अन्य
प्रकाशित: (2008)

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish [electronic resource] /
द्वारा: Noor Afzan Muhamad, 1985-
प्रकाशित: (2008)

Evaluation of different lead free solders : a study on intermetallics /
द्वारा: 457654 Lim, Chong Kheng
प्रकाशित: (2006)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
द्वारा: Koid, Chun Ping, 1987-, और अन्य
प्रकाशित: (2011)

Mechanism of IMC growth during non-linear solder reflow /
द्वारा: 374505 See, Phen Chiak
प्रकाशित: (2006)

Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes /
द्वारा: Saliza Azlina Osman, 1982-, और अन्य
प्रकाशित: (2012)

Evaluation of different lead free solders : a study on intermetallics [compact disc] /
द्वारा: 457654 Lim, Chong Kheng
प्रकाशित: (2006)

Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes [electronic resource] /
द्वारा: Saliza Azlina Osman, 1982-
प्रकाशित: (2012)

Effect of aging on intermetalica formed between lead free solder and Cu-Ni-Au under bump metallurgy (UBM) /
द्वारा: 411244 Madzuen Mokhtar
प्रकाशित: (2004)

Mechanism of IMC growth during non-linear solder reflow [compact disc] /
द्वारा: 374505 See, Phen Chiak
प्रकाशित: (2006)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
द्वारा: Koid, Chun Ping, 1987-
प्रकाशित: (2011)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]

समान संसाधन

समान संसाधन