Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Author:	Koh, Joyce Swee Fong
Format:
Language:	may
Published:	Skudai : Universiti Teknologi Malaysia, 2006
Subjects:	Solder and soldering Intermetallic compounds

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