Microelectronics packaging handbook/
| Main Authors: | , |
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| Format: | |
| Published: |
New York : Van Nostrand Reinhold,
1989
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| Subjects: |
| _version_ | 1826378989080412160 |
|---|---|
| author | Tummala, Rao R. Rymaszewski, Eugene J. |
| author_facet | Tummala, Rao R. Rymaszewski, Eugene J. |
| author_sort | Tummala, Rao R. |
| collection | OCEAN |
| description | |
| first_indexed | 2024-03-04T18:24:38Z |
| format | |
| id | KOHA-OAI-TEST:118710 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| last_indexed | 2024-03-04T18:24:38Z |
| publishDate | 1989 |
| publisher | New York : Van Nostrand Reinhold, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:1187102020-12-19T17:02:28ZMicroelectronics packaging handbook/ Tummala, Rao R. Rymaszewski, Eugene J. New York : Van Nostrand Reinhold,198916PSZJBLMicroelectronic packagingURN:ISBN:0442205783 |
| spellingShingle | Microelectronic packaging Tummala, Rao R. Rymaszewski, Eugene J. Microelectronics packaging handbook/ |
| title | Microelectronics packaging handbook/ |
| title_full | Microelectronics packaging handbook/ |
| title_fullStr | Microelectronics packaging handbook/ |
| title_full_unstemmed | Microelectronics packaging handbook/ |
| title_short | Microelectronics packaging handbook/ |
| title_sort | microelectronics packaging handbook |
| topic | Microelectronic packaging |
| work_keys_str_mv | AT tummalaraor microelectronicspackaginghandbook AT rymaszewskieugenej microelectronicspackaginghandbook |