Metallurgy of welding /

Metallurgy of welding /

Mostrar outras versões (1)

PSZJBL

Detalhes bibliográficos
Autor principal:	431515 Lancaster, J. F. (John Frederick)
Formato:
Publicado em:	London : George Allen & Unwin, 1980
Assuntos:	Welding Solder and soldering Brazing

Registros relacionados

Metallurgy of welding /
por: 431515 Lancaster, J. F. (John Frederick)
Publicado em: (1999)

The metallurgy of welding, brazing and soldering/
por: 431515 Lancaster, J. F. (John Frederick)
Publicado em: (1970)

Brazing and braze welding [filem jalur]
Publicado em: (1983)

Welding, brazing, soldering and braze welding of metals : nomenclature of processes and reference numbers for symbolic representation on drawings
por: 8096 British Standards Institution, et al.

Soldering, brazing welding and adhesives /
por: Andrews, D. R.
Publicado em: (1978)

Filler metals for joining/
por: 332072 Barnett, Orville T.
Publicado em: (1959)

Metals joining manual /
por: 346898 Schwartz, Mel M.
Publicado em: (1979)

Brazing and soldering [electronic resource] : Proceedings of the 3rd International Brazing and Soldering Conference, April 24-26, 2006, Crowne Plaza Riverwalk Hotel
por: 347648 International Brazing and Soldering Conference, et al.
Publicado em: (2006)

Brazing and soldering : proceedings of the 3rd International Brazing and Soldering Conference, April 24-26, 2006, Crowne Plaza Riverwalk Hotel
por: International Brazing and Soldering Conference (3rd : 2006 : San Antonio, Tex.), et al.
Publicado em: (2006)

Principles of soldering /
por: 454840 Humpston, Giles, et al.
Publicado em: (2004)

Soldering and brazing /
por: 212418 Cain, Tubal
Publicado em: (1985)

Joining : welding and soldering [filem]
por: British Broadcasting Corporation
Publicado em: (1977)

Joining : welding and soldering [kasetvieo]
Publicado em: (1977)

Study of welding on aluminum alloy 5083 / Mohd Noor Ariff Muhammad and Mohamad Nor Azuan Mohamad
por: Muhammad, Mohd Noor Ariff, et al.
Publicado em: (2002)

Solder metallurgy studies in flip chips /
por: 384464 Beh, Keh Shin
Publicado em: (2001)

Solder metallurgy studies in flip chips [microfilm] /
por: 384464 Beh, Keh Shin
Publicado em: (2001)

To obtain the optimum parameters for welding of copper and aluminum using friction welding technique / Mcdawson Dewk
por: Dewk, Mcdawson
Publicado em: (2010)

Ball attach yield improvement-DMAIC approach /
por: Mutukumaar Nallappan, 1984-, et al.
Publicado em: (2011)

Ball attach yield improvement-DMAIC approac [electronic resource] /
por: Mutukumaar Nallappan, 1984-
Publicado em: (2011)

International Symposium on Microjoining, Cambridge, UK, 20-21 September 1988 /
por: International Symposium on Microjoining (1988 : Cambridge, UK), et al.
Publicado em: (1989)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /
por: 458460 Wong, Lee Kian
Publicado em: (2003)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) [macrofilm] /
por: 458460 Wong, Lee Kian
Publicado em: (2003)

Solder joint technology : materials, properties, and reliability /
por: 391944 Tu, K. N. (King-ning), 1937-
Publicado em: (2007)

Introduction to welding, brazing, and cutting : module 04303-03
Publicado em: (2003)

Soldering /
por: 247850 Thwaites, C. J., et al.
Publicado em: (1975)

Failure analysis of solder joint on fine pitch devices /
por: 266816 Isaac Selvaraj Peter
Publicado em: (1999)

Methods of test for resin flux cored solder
por: 982 SIRIM

Evolution of internal states in a Sn-Pb solder joint during Re-flow and thermal cycles /
por: 209274 Liew, Yek Ban, et al.
Publicado em: (2004)

Soldering : introduction & vocabulary [filem jalur]
Publicado em: (1979)

Soft soldering [filem]
Publicado em: ([19-)

Theory and practice of soldering [filem]
Publicado em: ([19-)

Soft soldering [kasetvideo]
Publicado em: ([19-)

Theory and practice of soldering [kasetvideo]
Publicado em: ([19-)

Basic soldering for electronics [kasetvideo]
Publicado em: ([19-)

Effect of flux type on intermetallics formation in solder joint [microform] /
por: Cheong, Jeng Seng, et al.
Publicado em: (2005)

Soldering : understanding the basics /
por: Schwartz, Mel, editor
Publicado em: (2014)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
por: Koid, Chun Ping, 1987-, et al.
Publicado em: (2011)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish [electronic resource] /
por: Koid, Chun Ping, 1987-
Publicado em: (2011)

Interfacial reactions during soldering of lead-free solders on copper and nickel substrates /
por: Siti Rabiatull Aisha Idris, 1983-, et al.
Publicado em: (2012)

Interfacial reactions during soldering of lead-free solders on copper and nickel substrates [electronic resource] /
por: 288113 Siti Rabiatull Aisha Idris
Publicado em: (2012)