Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] /
Project Paper (Bachelor of Engineering (Mechanical - Production)) - Universiti Teknologi Malaysia, 2001
| Main Author: | |
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| Format: | |
| Language: | eng |
| Published: |
Skudai : Universiti Teknologi Malaysia,
2001
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| Subjects: |
| _version_ | 1796648178470092800 |
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| author | 217123 Ong, You Yang @ Bryan Ong |
| author_facet | 217123 Ong, You Yang @ Bryan Ong |
| author_sort | 217123 Ong, You Yang @ Bryan Ong |
| collection | OCEAN |
| description | Project Paper (Bachelor of Engineering (Mechanical - Production)) - Universiti Teknologi Malaysia, 2001 |
| first_indexed | 2024-03-04T13:18:04Z |
| format | |
| id | KOHA-OAI-TEST:16595 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-04T13:18:04Z |
| publishDate | 2001 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:165952020-12-19T16:55:45ZAdvance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] / 217123 Ong, You Yang @ Bryan Ong Skudai : Universiti Teknologi Malaysia,2001engProject Paper (Bachelor of Engineering (Mechanical - Production)) - Universiti Teknologi Malaysia, 200115PSZJBLIntegrated circuitsMicroelectronic packaging |
| spellingShingle | Integrated circuits Microelectronic packaging 217123 Ong, You Yang @ Bryan Ong Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] / |
| title | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] / |
| title_full | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] / |
| title_fullStr | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] / |
| title_full_unstemmed | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] / |
| title_short | Advance microelectronic packaging for miniaturize package : chip scale package (CSP) - SC70 series leadless package modelling production robustness determination [microfilm] / |
| title_sort | advance microelectronic packaging for miniaturize package chip scale package csp sc70 series leadless package modelling production robustness determination microfilm |
| topic | Integrated circuits Microelectronic packaging |
| work_keys_str_mv | AT 217123ongyouyangbryanong advancemicroelectronicpackagingforminiaturizepackagechipscalepackagecspsc70seriesleadlesspackagemodellingproductionrobustnessdeterminationmicrofilm |