Experimental simulation of thermal conduction in an electronic component [microfilm] /

Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2000

Sonraí bibleagrafaíochta
Príomhchruthaitheoirí: 394592 Pui, Hon Hwa, Md. Nor Anuar Mohamad
Formáid:
Teanga:may
Foilsithe / Cruthaithe: Skudai : Universiti Teknologi Malaysia, 2000
Ábhair:
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author 394592 Pui, Hon Hwa
Md. Nor Anuar Mohamad
author_facet 394592 Pui, Hon Hwa
Md. Nor Anuar Mohamad
author_sort 394592 Pui, Hon Hwa
collection OCEAN
description Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2000
first_indexed 2024-03-04T13:19:21Z
format
id KOHA-OAI-TEST:17021
institution Universiti Teknologi Malaysia - OCEAN
language may
last_indexed 2024-03-04T13:19:21Z
publishDate 2000
publisher Skudai : Universiti Teknologi Malaysia,
record_format dspace
spelling KOHA-OAI-TEST:170212020-12-19T16:55:46ZExperimental simulation of thermal conduction in an electronic component [microfilm] / 394592 Pui, Hon Hwa Md. Nor Anuar Mohamad Skudai : Universiti Teknologi Malaysia,2000mayProject Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 20000PSZJBLThermal analysisElectronic componentsJigs and fixturesDiesel motorMolding materialsMolding (Founding)Combustion engineeringCombustion engineering
spellingShingle Thermal analysis
Electronic components
Jigs and fixtures
Diesel motor
Molding materials
Molding (Founding)
Combustion engineering
Combustion engineering
394592 Pui, Hon Hwa
Md. Nor Anuar Mohamad
Experimental simulation of thermal conduction in an electronic component [microfilm] /
title Experimental simulation of thermal conduction in an electronic component [microfilm] /
title_full Experimental simulation of thermal conduction in an electronic component [microfilm] /
title_fullStr Experimental simulation of thermal conduction in an electronic component [microfilm] /
title_full_unstemmed Experimental simulation of thermal conduction in an electronic component [microfilm] /
title_short Experimental simulation of thermal conduction in an electronic component [microfilm] /
title_sort experimental simulation of thermal conduction in an electronic component microfilm
topic Thermal analysis
Electronic components
Jigs and fixtures
Diesel motor
Molding materials
Molding (Founding)
Combustion engineering
Combustion engineering
work_keys_str_mv AT 394592puihonhwa experimentalsimulationofthermalconductioninanelectroniccomponentmicrofilm
AT mdnoranuarmohamad experimentalsimulationofthermalconductioninanelectroniccomponentmicrofilm