Experimental simulation of thermal conduction in an electronic component [microfilm] /
Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2000
Main Authors: | 394592 Pui, Hon Hwa, Md. Nor Anuar Mohamad |
---|---|
格式: | |
语言: | may |
出版: |
Skudai : Universiti Teknologi Malaysia,
2000
|
主题: |
相似书籍
-
Experimental simulation of thermal conduction in an electronic component /
由: 394592 Pui, Hon Hwa
出版: (2000) -
Resin transfer moulding (RTM) /
由: 204926 Shukur Abu Hassan, et al. -
Jig and fixture components
由: 8096 British Standards Institution -
Jigs and fixtures /
由: Boyes, William E.
出版: (1982) -
Rekabentuk acuan batu pasir berukiran [microfilm] /
由: Md. Zamzuri Harjin
出版: (2000)