Experimental simulation of thermal conduction in an electronic component [microfilm] /

Experimental simulation of thermal conduction in an electronic component [microfilm] /

Project Paper (Bachelor of Mechanical Engineering) - Universiti Teknologi Malaysia, 2000

书目详细资料
Main Authors:	394592 Pui, Hon Hwa, Md. Nor Anuar Mohamad
格式:
语言:	may
出版:	Skudai : Universiti Teknologi Malaysia, 2000
主题:	Thermal analysis Electronic components Jigs and fixtures Diesel motor Molding materials Molding (Founding) Combustion engineering

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