Top down milling of package substrate for planar delayering [microfilm] /
Project Paper (Bachelor of Engineering (Mechanical) - University Teknologi Malaysia, 2002
| Main Author: | |
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| Format: | |
| Language: | may |
| Published: |
Skudai : Universiti Teknologi Malaysia,
2002
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| Subjects: |
| _version_ | 1826358385725931520 |
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| author | 425768 Lai, Lih Sing |
| author_facet | 425768 Lai, Lih Sing |
| author_sort | 425768 Lai, Lih Sing |
| collection | OCEAN |
| description | Project Paper (Bachelor of Engineering (Mechanical) - University Teknologi Malaysia, 2002 |
| first_indexed | 2024-03-04T13:20:08Z |
| format | |
| id | KOHA-OAI-TEST:17280 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | may |
| last_indexed | 2024-03-04T13:20:08Z |
| publishDate | 2002 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:172802020-12-19T16:55:47ZTop down milling of package substrate for planar delayering [microfilm] / 425768 Lai, Lih Sing Skudai : Universiti Teknologi Malaysia,2002mayProject Paper (Bachelor of Engineering (Mechanical) - University Teknologi Malaysia, 200216PSZJBLElectronic packagingDielectries |
| spellingShingle | Electronic packaging Dielectries 425768 Lai, Lih Sing Top down milling of package substrate for planar delayering [microfilm] / |
| title | Top down milling of package substrate for planar delayering [microfilm] / |
| title_full | Top down milling of package substrate for planar delayering [microfilm] / |
| title_fullStr | Top down milling of package substrate for planar delayering [microfilm] / |
| title_full_unstemmed | Top down milling of package substrate for planar delayering [microfilm] / |
| title_short | Top down milling of package substrate for planar delayering [microfilm] / |
| title_sort | top down milling of package substrate for planar delayering microfilm |
| topic | Electronic packaging Dielectries |
| work_keys_str_mv | AT 425768lailihsing topdownmillingofpackagesubstrateforplanardelayeringmicrofilm |