Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2007
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| Language: | eng |
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2007
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| _version_ | 1796681691176108032 |
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| author | 576681 Nor Akmal Fadil Ali Ourdjini Fakulti Kejuruteraan Mekanikal |
| author_facet | 576681 Nor Akmal Fadil Ali Ourdjini Fakulti Kejuruteraan Mekanikal |
| author_sort | 576681 Nor Akmal Fadil |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2007 |
| first_indexed | 2024-03-04T21:31:47Z |
| format | |
| id | KOHA-OAI-TEST:180913 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-04T21:31:47Z |
| publishDate | 2007 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:1809132020-12-19T17:05:00ZEffect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes / 576681 Nor Akmal Fadil Ali Ourdjini Fakulti Kejuruteraan Mekanikal 2007engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2007Includes bibliographical referencesFEMELFlip chip technology Intermetallic compounds |
| spellingShingle | Flip chip technology Intermetallic compounds 576681 Nor Akmal Fadil Ali Ourdjini Fakulti Kejuruteraan Mekanikal Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes / |
| title | Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes / |
| title_full | Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes / |
| title_fullStr | Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes / |
| title_full_unstemmed | Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes / |
| title_short | Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes / |
| title_sort | effect of solder volume on interfacial reactions imc on copper and electroless nickel electroless palladium immersion gold enepig finishes |
| topic | Flip chip technology Intermetallic compounds |
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