Study of interfacial reactions between lead-free solders and immersion silver finish /

Study of interfacial reactions between lead-free solders and immersion silver finish /

Bibliographic Details
Main Authors:	Safoura Oshaghi, 1977-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2008
Subjects:	Electronic packaging
Online Access:	http://eprints.utm.my/9546

Similar Items

Study of interfacial reactions between lead-free solders and immersion silver finish [electronic resource] /
by: Safoura Oshaghi, 1977-, et al.
Published: (2008)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes /
by: Ali Ourdjini, author, et al.
Published: (2011)

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes /
by: Siti Rabiatull Aisha Idris, 1983-, et al.
Published: (2008)

Study of interfacial reactions between lead-free solders and immersion silver finish
by: Oshaghi, Safoura
Published: (2008)

The interfacial reactions between lead-free solder and immersion silver finish /
by: Nor Afiza Khamis, 1985-, et al.
Published: (2008)

Interfacial reactions during soldering of Sn - Ag - Cu lead free solders on immersion silver and electroless nickel / immersion gold surface finishes [electronic resource] /
by: Siti Rabiatull Aisha Idris, 1983-, et al.
Published: (2008)

Interfacial reactions during soldering between lead-free solders and immersion silver surface finish /
by: Tyah, Jun Hao, 1985-, et al.
Published: (2009)

Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish /
by: Nor Diyana Mutalif, 1985-, et al.
Published: (2008)

Interfacial reaction during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel /immersion gold surface finishes /
by: 183648 Ali Ourdjini, et al.
Published: (2007)

The interfacial reactions between lead-free solder and immersion silver finish [electronic resource] /
by: Nor Afiza Khamis, 1985-, et al.
Published: (2008)

Interfacial reactions between lead - free solders and electroless nickel/immersion gold (ENIG) surface finish /
by: Boo, Nan Shing, 1981-, et al.
Published: (2010)

Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes /
by: Nurfazlin Abu Hassan, 1984-, et al.
Published: (2009)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
by: Chua, Chai Ying, 1985-, et al.
Published: (2009)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish /
by: Ch'ng, Emily Huey Ling, 1984-, et al.
Published: (2007)

Interfacial reactions during soldering between lead-free solders and immersion silver surface finish [electronic resource] /
by: Tyah, Jun Hao, 1985-
Published: (2009)

Interfacial reactions between Sn-3.0Ag-0.5Cu solder and immersion silver surface finish [electronic resource] /
by: Nor Diyana Mutalif, 1985-
Published: (2008)

Intermetallic compound in lead free solder on electroless nickel/immersion gold surface finish /
by: 458141 Mah, Chia Wen
Published: (2003)

Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
by: Idris, Siti Rabiatull Aisha
Published: (2008)

Interfacial reactions between lead - free solders and electroless nickel/immersion gold (ENIG) surface finish [electronic resource] /
by: Boo, Nan Shing, 1981-, et al.
Published: (2010)

Study on interfacial reaction between lead-free solders and alternative surface finishes
by: Idris, Siti rabiatull aisha, et al.
Published: (2007)

Interfacial reactions during soldering of lead-free solders on copper and nickel substrates /
by: Siti Rabiatull Aisha Idris, 1983-, et al.
Published: (2012)

Study of interfacial reation during reflow soldering of Sn- Ag - Cu lead - free solders on bare copper and immersion silver surface finishes [electronic resource] /
by: Nurfazlin Abu Hassan, 1984-, et al.
Published: (2009)

Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes /
by: Saliza Azlina Osman, 1982-, et al.
Published: (2012)

Effect of solder volume on interfacial reactions (IMC) on copper and Electroless Nickel / Electroless Palladium/ Immersion Gold (ENEPIG) finishes /
by: 576681 Nor Akmal Fadil, et al.
Published: (2007)

Study of interfacial reaction during reflow soldering of Sn-Ag-Cu lead-free solders on bare coppper and immersion silver surface finishes
by: Abu Hassan, Nurfazlin
Published: (2009)

Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish /
by: Saliza Azlina Osman, 1982-, et al.
Published: (2008)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
by: 170422 Chua, Chai Ying, et al.
Published: (2009)

Interfacial reactions between lead-free solders and electroless nickel/immersion gold surface finish /
by: Mohd. Muzamir Mahat, 1986-, et al.
Published: (2009)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
by: 458317 Liew, Chung Wah, et al.
Published: (2007)

Interfacial reactions between lead- free solders and electroless nickel/ immersion gold (ENIG) surface finish
by: Boo, Nan Shing
Published: (2010)

Effect of multiple reflow on interfacial reactions between solder and substrate finish (enep&enepig) /
by: 408882 Nuraini Fadhil, et al.
Published: (2007)

Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish /
by: Azizah Wahi, 1984-, et al.
Published: (2009)

Interfacial reactions between lead-free solders and electroless nickel/immersion gold surface finish [electronic resource] /
by: Mohd. Muzamir Mahat, 1986-, et al.
Published: (2009)

Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
by: Mohamed Anuar, Rabiatul Adawiyah
Published: (2017)

Effect of reflow soldering and isothermal aging on interfacial microstructure between lead-free solder alloy and different surface finishes
by: Tan, C. L., et al.
Published: (2006)

Interfacial reactions between lead-free solders and ENIG/ENEPIG surface finishes /
by: 282552 Saszlena Rasmi
Published: (2006)

Intermetallic formation during soldering between lead-free solders and immersion silver surface finish / [compact disc]
by: Ch'ng, Emily Huey Ling, 1984-
Published: (2007)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold /
by: Ng, Mei Wah, 1986-, et al.
Published: (2010)

Interfacial reactions between Sn - Ag - Cu solder and Cu - Ni - Pd and Cu - Ni - Au surface finishes /
by: 323613 Azizah Wahi, et al.
Published: (2007)

Interfacial reactions between lead-free solders and engineering surface finishes [electronic resource ] /
by: 282552 Saszlena Rasmi
Published: (2006)