Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product /
Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007
| Main Authors: | , , |
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| Format: | |
| Language: | eng |
| Published: |
2007
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| _version_ | 1796684864090537984 |
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| author | 452473 Cheah, Ui Ping Nazri Kamsah Fakulti Kejuruteraan Mekanikal |
| author_facet | 452473 Cheah, Ui Ping Nazri Kamsah Fakulti Kejuruteraan Mekanikal |
| author_sort | 452473 Cheah, Ui Ping |
| collection | OCEAN |
| description | Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007 |
| first_indexed | 2024-03-04T22:18:27Z |
| format | |
| id | KOHA-OAI-TEST:196355 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-04T22:18:27Z |
| publishDate | 2007 |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:1963552020-12-19T17:05:35ZFinite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product / 452473 Cheah, Ui Ping Nazri Kamsah Fakulti Kejuruteraan Mekanikal 2007engProject Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007Includes bibliographical referencesFEMELFinite element methodPrinted circuits |
| spellingShingle | Finite element method Printed circuits 452473 Cheah, Ui Ping Nazri Kamsah Fakulti Kejuruteraan Mekanikal Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product / |
| title | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product / |
| title_full | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product / |
| title_fullStr | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product / |
| title_full_unstemmed | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product / |
| title_short | Finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product / |
| title_sort | finite element simulation of drop impact of printed circuit board package assembly of generic mobile electronics product |
| topic | Finite element method Printed circuits |
| work_keys_str_mv | AT 452473cheahuiping finiteelementsimulationofdropimpactofprintedcircuitboardpackageassemblyofgenericmobileelectronicsproduct AT nazrikamsah finiteelementsimulationofdropimpactofprintedcircuitboardpackageassemblyofgenericmobileelectronicsproduct AT fakultikejuruteraanmekanikal finiteelementsimulationofdropimpactofprintedcircuitboardpackageassemblyofgenericmobileelectronicsproduct |