Methodology for hybrid experimental-numerical determination of solder/intermetallic interface shear strength /

Methodology for hybrid experimental-numerical determination of solder/intermetallic interface shear strength /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

Bibliographic Details
Main Authors:	Low, Kok Wai, 1984-, Mohd. Nasir Tamin, supervisor, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2007
Subjects:	Solder and soldering Microelectronics

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