Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

Bibliographic Details
Main Authors: 458317 Liew, Chung Wah, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Published: 2007
Subjects:
Intermetallic compounds
Solder and soldering
Description
Summary:Project Paper (Sarjana Muda Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2007

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