Solder joint reliability prediction for multiple environments /
16
| Main Authors: | , |
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| 格式: | |
| 语言: | eng |
| 出版: |
New York : Springer,
2008
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| 主题: |
| _version_ | 1826396196782997504 |
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| author | 185890 Perkins, Andrew E. Sitaraman, Suresh |
| author_facet | 185890 Perkins, Andrew E. Sitaraman, Suresh |
| author_sort | 185890 Perkins, Andrew E. |
| collection | OCEAN |
| description | 16 |
| first_indexed | 2024-03-04T22:32:58Z |
| format | |
| id | KOHA-OAI-TEST:201222 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-04T22:32:58Z |
| publishDate | 2008 |
| publisher | New York : Springer, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2012222020-12-19T17:05:45ZSolder joint reliability prediction for multiple environments / 185890 Perkins, Andrew E. Sitaraman, Suresh New York : Springer,2008eng16PSZJBLElectronic apparatus and appliancesSolder and solderingJoints (Engineering)URN:ISBN:9780387793931 (hbk.) |
| spellingShingle | Electronic apparatus and appliances Solder and soldering Joints (Engineering) 185890 Perkins, Andrew E. Sitaraman, Suresh Solder joint reliability prediction for multiple environments / |
| title | Solder joint reliability prediction for multiple environments / |
| title_full | Solder joint reliability prediction for multiple environments / |
| title_fullStr | Solder joint reliability prediction for multiple environments / |
| title_full_unstemmed | Solder joint reliability prediction for multiple environments / |
| title_short | Solder joint reliability prediction for multiple environments / |
| title_sort | solder joint reliability prediction for multiple environments |
| topic | Electronic apparatus and appliances Solder and soldering Joints (Engineering) |
| work_keys_str_mv | AT 185890perkinsandrewe solderjointreliabilitypredictionformultipleenvironments AT sitaramansuresh solderjointreliabilitypredictionformultipleenvironments |