Solder joint reliability prediction for multiple environments /

Solder joint reliability prediction for multiple environments /

16

书目详细资料
Main Authors:	185890 Perkins, Andrew E., Sitaraman, Suresh
格式:
语言:	eng
出版:	New York : Springer, 2008
主题:	Electronic apparatus and appliances Solder and soldering Joints (Engineering)

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