Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly /
16
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| Published: |
New York : Van Nostrand Reinhold,
1992
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| Subjects: |
| _version_ | 1796688377291997184 |
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| author | 342034 Hwang, Jennie S. |
| author_facet | 342034 Hwang, Jennie S. |
| author_sort | 342034 Hwang, Jennie S. |
| collection | OCEAN |
| description | 16 |
| first_indexed | 2024-03-04T23:10:13Z |
| format | |
| id | KOHA-OAI-TEST:213723 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| last_indexed | 2024-03-04T23:10:13Z |
| publishDate | 1992 |
| publisher | New York : Van Nostrand Reinhold, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2137232020-12-19T17:06:15ZSolder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly / 342034 Hwang, Jennie S. New York : Van Nostrand Reinhold,199216PSZJBLPrinted circuitsSolder pastesSurface mount technologyURN:ISBN:0442013531 |
| spellingShingle | Printed circuits Solder pastes Surface mount technology 342034 Hwang, Jennie S. Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly / |
| title | Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly / |
| title_full | Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly / |
| title_fullStr | Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly / |
| title_full_unstemmed | Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly / |
| title_short | Solder paste in electronics packaging : technology and applications in surface mount, hybrid, circuits, and component assembly / |
| title_sort | solder paste in electronics packaging technology and applications in surface mount hybrid circuits and component assembly |
| topic | Printed circuits Solder pastes Surface mount technology |
| work_keys_str_mv | AT 342034hwangjennies solderpasteinelectronicspackagingtechnologyandapplicationsinsurfacemounthybridcircuitsandcomponentassembly |