Area array packaging handbook /

類似資料

• Area array packaging materials : adhesives, pastes, and lead-free /
  著者:: Gilleo, Ken
  出版事項: (2004)
• Area array packaging processes : for BGA, Flip Chip, and CSP /
  著者:: Gilleo, Ken
  出版事項: (2004)
• MEMS/MOEMS packaging : concepts, designs, metarials, and processes /
  著者:: 193092 Gilleo, Ken
  出版事項: (2005)
• Thermal analysis of flip chip ball grid array (FCBGA) electronics package using finite element method /
  著者:: Nor Haizully Azizan, 1985-, 等
  出版事項: (2008)
• Area array package design : techniques in high-density electronics /
  著者:: Gilleo, Ken
  出版事項: (2004)