Towards defect free SMT reflow soldering process /
Project Paper (Bachelor of Engineering (Mechanical) - University Teknologi Malaysia, 2002
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| Format: | |
| Sprog: | eng |
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Skudai : Universiti Teknologi Malaysia,
2002
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| Fag: |
| _version_ | 1826401521079681024 |
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| author | 181409 Yow, Huoy Thyng |
| author_facet | 181409 Yow, Huoy Thyng |
| author_sort | 181409 Yow, Huoy Thyng |
| collection | OCEAN |
| description | Project Paper (Bachelor of Engineering (Mechanical) - University Teknologi Malaysia, 2002 |
| first_indexed | 2024-03-04T23:50:00Z |
| format | |
| id | KOHA-OAI-TEST:226825 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-04T23:50:00Z |
| publishDate | 2002 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2268252020-12-19T17:06:48ZTowards defect free SMT reflow soldering process / 181409 Yow, Huoy Thyng Skudai : Universiti Teknologi Malaysia,2002engProject Paper (Bachelor of Engineering (Mechanical) - University Teknologi Malaysia, 2002Mikrofilem negatif : MFL 11937 ra16PRZSLElectronic packagingSurface mount technologySolder and soldering |
| spellingShingle | Electronic packaging Surface mount technology Solder and soldering 181409 Yow, Huoy Thyng Towards defect free SMT reflow soldering process / |
| title | Towards defect free SMT reflow soldering process / |
| title_full | Towards defect free SMT reflow soldering process / |
| title_fullStr | Towards defect free SMT reflow soldering process / |
| title_full_unstemmed | Towards defect free SMT reflow soldering process / |
| title_short | Towards defect free SMT reflow soldering process / |
| title_sort | towards defect free smt reflow soldering process |
| topic | Electronic packaging Surface mount technology Solder and soldering |
| work_keys_str_mv | AT 181409yowhuoythyng towardsdefectfreesmtreflowsolderingprocess |