Towards defect free SMT reflow soldering process /

Towards defect free SMT reflow soldering process /

Project Paper (Bachelor of Engineering (Mechanical) - University Teknologi Malaysia, 2002

书目详细资料
主要作者:	181409 Yow, Huoy Thyng
格式:
语言:	eng
出版:	Skudai : Universiti Teknologi Malaysia, 2002
主题:	Electronic packaging Surface mount technology Solder and soldering

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