Mechanism of IMC growth during non-linear solder reflow /

Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2006

Bibliographic Details
Main Author: 374505 See, Phen Chiak
Format:
Language:eng
Published: Skudai : Universiti Teknologi Malaysia, 2006
Subjects:
Online Access:http://www.psz.utm.my/sla/billing/login.asp?mid=54972

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