Mechanism of IMC growth during non-linear solder reflow /
Project Paper (Sarjana Muda Kejuruteraan Mekanikal (Bahan)) - Universiti Teknologi Malaysia, 2006
Main Author: | 374505 See, Phen Chiak |
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Format: | |
Language: | eng |
Published: |
Skudai : Universiti Teknologi Malaysia,
2006
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Subjects: | |
Online Access: | http://www.psz.utm.my/sla/billing/login.asp?mid=54972 |
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