Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM /
Project Paper (Bachelor of Mechanical Engineering (Manufacturing)) - Universiti Teknologi Malaysia, 2003
| Autor principal: | |
|---|---|
| Formato: | |
| Lenguaje: | eng |
| Publicado: |
Skudai : Universiti Teknologi Malaysia,
2003
|
| Materias: |