Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM /

Podobne zapisy

• Evaluation of solder interconnection between sn-ag-cu solder and electroless nickel/imersion gold (ENIG) UBM [microfilm] /
  od: Phang, Chin Ewe
  Wydane: (2003)
• Study of dissolution nickel layer in enig surface finish during reflow soldering /
  od: 177816 Wong, Mun Hon, i wsp.
  Wydane: (2006)
• Study of dissolution nickel layer in enig surface finish during reflow soldering [electronic resource] /
  od: 177816 Wong, Mun Hon, i wsp.
  Wydane: (2006)
• Interfacial reaction during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel /immersion gold surface finishes /
  od: 183648 Ali Ourdjini, i wsp.
  Wydane: (2007)
• Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish /
  od: 399565 Tai, Siew Fong
  Wydane: (2003)