Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish /

Tin whisker formation and intermetallic compound between tin - silver - copper solders and immersion tin finish /

Thesis (Sarjana Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2009

Bibliographic Details
Main Authors:	Azizah Wahi, 1984-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Format:
Language:	eng
Published:	2009
Subjects:	Solder and soldering

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