Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish /

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish /

Project Paper (Sarjana Muda Kejuruteraan (Mekanikal - Bahan)) - Universiti Teknologi Malaysia, 2008

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριοι συγγραφείς:	Noor Afzan Muhamad, 1985-, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal
Μορφή:
Έκδοση:	2008
Θέματα:	Intermetallic compounds Solder and soldering

Παρόμοια τεκμήρια

Intermetallic compounds between Sn-Ag-Cu soldiers and enig surface finish [electronic resource] /
ανά: Noor Afzan Muhamad, 1985-
Έκδοση: (2008)

Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /
ανά: 288113 Siti Rabiatull Aisha Idris, κ.ά.
Έκδοση: (2006)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish /
ανά: Chin, Ee Mei, 1986-, κ.ά.
Έκδοση: (2010)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish /
ανά: 458317 Liew, Chung Wah, κ.ά.
Έκδοση: (2007)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish /
ανά: Tan, Luyeen, 1986-, κ.ά.
Έκδοση: (2010)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish/
ανά: 244946 Ang, Pei Ling, κ.ά.
Έκδοση: (2008)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish /
ανά: Chua, Chai Ying, 1985-, κ.ά.
Έκδοση: (2009)

Intermetallics formation during soldering between Sn-4Ag-0.5Cu solder and immersion silver finish [electronic resource] /
ανά: 458317 Liew, Chung Wah
Έκδοση: (2007)

Effect of Ni additions on intermetallics formed between Sn-Ag-Cu solders and en(B)epig surface finish [electronic resource] /
ανά: Chin, Ee Mei, 1986-
Έκδοση: (2010)

Study of intermetallic compound formation during soldering on Cu-Ni Pd finish [electronic resource] /
ανά: 244946 Ang, Pei Ling, κ.ά.
Έκδοση: (2008)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish /
ανά: 200265 Moey, Chin Boon
Έκδοση: (2005)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold /
ανά: Ng, Mei Wah, 1986-, κ.ά.
Έκδοση: (2010)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [microfilm] /
ανά: Moey, Chin Boon
Έκδοση: (2006)

Effect of multiple reflow on intermetallic compaund formed between Sn-Ag-Cu lead-free solders and en(P)IG surface finish [electronic resource] /
ανά: Tan, Luyeen, 1986-
Έκδοση: (2010)

The effects of heat treatment on the formation of intermetallics formation of solder joints between Sn-Ag-Cu and eutectic Pb-Sn solders and electroless nickel immersion gold surface finish [compact disc] /
ανά: 200265 Moey, Chin Boon
Έκδοση: (2005)

Intermetallic formation during soldering on EPIG and Cu surface finishes /
ανά: 285723 Yusreena Yusuf
Έκδοση: (2006)

Interfacial reactions between lead-free solders and ENIG/ENEPIG surface finishes /
ανά: 282552 Saszlena Rasmi
Έκδοση: (2006)

Intermetallic formation during soldering on EPIG and Cu surface finishes [electronic resource] /
ανά: 285723 Yusreena Yusuf
Έκδοση: (2006)

Intermetallic compound (IMC) formation in lead free soldering on immersion silver finish [electronic resource] /
ανά: 170422 Chua, Chai Ying, κ.ά.
Έκδοση: (2009)

Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
ανά: Mayappan, Ramani, κ.ά.
Έκδοση: (2010)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish /
ανά: 397935 Koh, Joyce Swee Fong
Έκδοση: (2006)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish / [microform]
ανά: Koh, Joyce Swee Fong
Έκδοση: (2006)

Effect of solder bump size on intermetallic compound formation during soldering on NI-AU surface finish [compact disc] /
ανά: 397935 Koh, Joyce Swee Fong
Έκδοση: (2006)

Effect of nickel dopant on intermetallic compound formation between Sn-Ag-Cu solders and electroless nickel (boron)/immersion gold [electronic resource] /
ανά: Ng, Mei Wah, 1986-
Έκδοση: (2010)

Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG /
ανά: 214468 Jalilah Che Mohamed
Έκδοση: (2006)

Effect of solder bump size on intermetallic compound formation between solder and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish /
ανά: 380319 Ching, Sze Pei
Έκδοση: (2006)

Nickel layer consumption during reflow soldering between Sn-Ag-Cu and ENEPIG [compact disc] /
ανά: 214468 Jalilah Che Mohamed
Έκδοση: (2006)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint /
ανά: 351526 Tan, Kok Hoong
Έκδοση: (2006)

Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes /
ανά: Saliza Azlina Osman, 1982-, κ.ά.
Έκδοση: (2012)

Effect of nickel doping in Sn-Ag-Cu solder on intermetallic growth during soldering on Ni(P)-Au surface finish /
ανά: Koid, Chun Ping, 1987-, κ.ά.
Έκδοση: (2011)

Effect of medium phosphorus content in nickel plating solution on intermetallic compounds formation in solder joint [compact disc] /
ανά: 351526 Tan, Kok Hoong
Έκδοση: (2006)

Effect of flux type on intermetallics formation in solder joint /
ανά: 296018 Cheong, Jeng Seng
Έκδοση: (2005)

Effect of flux type on intermetallics formation in solder joint [compact disc] /
ανά: 296018 Cheong, Jeng Seng
Έκδοση: (2005)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) /
ανά: 458460 Wong, Lee Kian
Έκδοση: (2003)

Intermetallics in lead-free solder on direct immersion gold (dig) under bump metallurgy (UBM) [macrofilm] /
ανά: 458460 Wong, Lee Kian
Έκδοση: (2003)

Interfacial reactions between lead-free solders and engineering surface finishes [electronic resource ] /
ανά: 282552 Saszlena Rasmi
Έκδοση: (2006)

Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish /
ανά: Saliza Azlina Osman, 1982-, κ.ά.
Έκδοση: (2008)

Intermetallic formation between lead-based solder and Cu/Ni/Au under bump metallurgy (UBM) /
ανά: 396114 Nordiana Najib
Έκδοση: (2004)

Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes [electronic resource] /
ανά: Saliza Azlina Osman, 1982-
Έκδοση: (2012)

Study of dissolution nickel layer in enig surface finish during reflow soldering /
ανά: 177816 Wong, Mun Hon, κ.ά.
Έκδοση: (2006)