Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy /
Project Paper (Bachelor of Mechanical Engineering (Material)) - Universiti Teknologi Malaysia, 2003
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| Format: | |
| Language: | eng |
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Skudai : Universiti Teknologi Malaysia,
2003
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| Subjects: |
| _version_ | 1796697203962544128 |
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| author | 204538 Kee, Hang Ching |
| author_facet | 204538 Kee, Hang Ching |
| author_sort | 204538 Kee, Hang Ching |
| collection | OCEAN |
| description | Project Paper (Bachelor of Mechanical Engineering (Material)) - Universiti Teknologi Malaysia, 2003 |
| first_indexed | 2024-03-05T01:15:16Z |
| format | |
| id | KOHA-OAI-TEST:255289 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T01:15:16Z |
| publishDate | 2003 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2552892020-12-19T17:08:02ZStudy of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy / 204538 Kee, Hang Ching Skudai : Universiti Teknologi Malaysia,2003engProject Paper (Bachelor of Mechanical Engineering (Material)) - Universiti Teknologi Malaysia, 2003Mikrofilem negatif : MFL 12402 ra09PRZSLIntermetallic compoundsAlloysPhysical metallurgy |
| spellingShingle | Intermetallic compounds Alloys Physical metallurgy 204538 Kee, Hang Ching Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy / |
| title | Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy / |
| title_full | Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy / |
| title_fullStr | Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy / |
| title_full_unstemmed | Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy / |
| title_short | Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy / |
| title_sort | study of intermetallic compounds formed between different lead free solders and electroless nickel immersion gold under bump metallurgy |
| topic | Intermetallic compounds Alloys Physical metallurgy |
| work_keys_str_mv | AT 204538keehangching studyofintermetalliccompoundsformedbetweendifferentleadfreesoldersandelectrolessnickelimmersiongoldunderbumpmetallurgy |