Study of intermetallic compounds formed between different lead-free solders and electroless nickel / immersion gold under bump metallurgy /
Project Paper (Bachelor of Mechanical Engineering (Material)) - Universiti Teknologi Malaysia, 2003
Main Author: | 204538 Kee, Hang Ching |
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Format: | |
Language: | eng |
Published: |
Skudai : Universiti Teknologi Malaysia,
2003
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Subjects: |
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