Electroplating bumping development for semiconductor QFN packages /
Project Paper (Bachelor of Mechanical Engineering (Production)) - Universiti Teknologi Malaysia, 2003
| 主要作者: | |
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| 格式: | |
| 语言: | eng |
| 出版: |
Skudai : Universiti Teknologi Malaysia,
2003
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| 主题: |
| _version_ | 1826407466264428544 |
|---|---|
| author | 447411 Lee, Yee Keat |
| author_facet | 447411 Lee, Yee Keat |
| author_sort | 447411 Lee, Yee Keat |
| collection | OCEAN |
| description | Project Paper (Bachelor of Mechanical Engineering (Production)) - Universiti Teknologi Malaysia, 2003 |
| first_indexed | 2024-03-05T01:16:34Z |
| format | |
| id | KOHA-OAI-TEST:255722 |
| institution | Universiti Teknologi Malaysia - OCEAN |
| language | eng |
| last_indexed | 2024-03-05T01:16:34Z |
| publishDate | 2003 |
| publisher | Skudai : Universiti Teknologi Malaysia, |
| record_format | dspace |
| spelling | KOHA-OAI-TEST:2557222020-12-19T17:08:03ZElectroplating bumping development for semiconductor QFN packages / 447411 Lee, Yee Keat Skudai : Universiti Teknologi Malaysia,2003engProject Paper (Bachelor of Mechanical Engineering (Production)) - Universiti Teknologi Malaysia, 2003Negative mikrofilm : MFL 12678 ra22PRZSLElectroplatingAluminum |
| spellingShingle | Electroplating Aluminum 447411 Lee, Yee Keat Electroplating bumping development for semiconductor QFN packages / |
| title | Electroplating bumping development for semiconductor QFN packages / |
| title_full | Electroplating bumping development for semiconductor QFN packages / |
| title_fullStr | Electroplating bumping development for semiconductor QFN packages / |
| title_full_unstemmed | Electroplating bumping development for semiconductor QFN packages / |
| title_short | Electroplating bumping development for semiconductor QFN packages / |
| title_sort | electroplating bumping development for semiconductor qfn packages |
| topic | Electroplating Aluminum |
| work_keys_str_mv | AT 447411leeyeekeat electroplatingbumpingdevelopmentforsemiconductorqfnpackages |